400G Photonics Integration Progress

New TGV-based board advances high-speed optical engine testing

OpenLight and Suzhou TFC Optical Communication have advanced silicon photonics back-end integration with a new evaluation platform supporting data rates up to 400G, signalling continued progress in scaling optical interconnect performance for next-generation networks.

– Advertisement –

At the centre of the development is the OLP-PM13306 evaluation board, designed to test a 400G electro-absorption modulator (EAM). The platform integrates a high-speed modulator driver alongside a photonic integrated circuit (PIC), built on a multi-layer through-glass-via (TGV) substrate. The design enables high-bandwidth signal transmission while maintaining signal integrity, a key requirement as per-lane data rates climb.

The board was developed using OpenLight’s heterogeneous indium phosphide-on-silicon (InP-on-Si) integration process, combined with TFC’s expertise in optical sub-assembly and advanced packaging. The system also incorporates a low-loss fiber attach unit, forming a complete optical engine prototype ready for evaluation and system-level testing.

This release reflects a broader industry push to mature the silicon photonics back-end ecosystem. While front-end photonic integration has seen rapid innovation, packaging, assembly, and manufacturing workflows are increasingly becoming the bottleneck—especially as applications in AI/ML infrastructure, hyperscale data centres, and high-speed optical networks demand higher throughput and tighter integration.

The collaboration between the two companies, first announced in 2025, has steadily expanded from supporting 100G and 200G per-lane transmitter PICs to now enabling 400G-class devices. The shift underscores both the rising performance targets and the need for scalable manufacturing approaches to keep pace with the complexity of optical engines.

By combining TGV-based PCB design, fibre integration, and assembly into a unified workflow, the partnership aims to simplify the supply chain from wafer-level photonics to fully packaged optical engines. This approach is expected to reduce manufacturing complexity and accelerate time-to-market for customers developing high-speed optical modules. The 400G evaluation platform will be demonstrated at OFC 2026, where both companies are expected to highlight advancements in photonic integration and optical sub-assembly technologies.